Panasonic Develops 100μm Ultrathin Film for Mass Production of Electronic Products

Thermal insulation film developed (left) and its effect example (right) Panasonic data.

Panasonic has developed an ultra-thin thermal insulation film that is a self-manufacturing process for heat dissipation in a narrow space for electronic products. Panasonic introduced the "NABIS (NAno Silica Baloon InSulator)" ultrathin thermal insulation film with a thickness of 100 μm using this process, and will begin mass production in June 2015.

Matsushita said that the commonly used heat insulation materials are roughly classified into fibers such as glass fiber and polyester, and foams such as polyurethane foam. Although the application involves many fields such as construction materials, vehicles, and home appliances, the thickness is mainly from several mm to several cm. Recently, as the electronic products are small, thin, and high-performance, heat-dissipating problems of hot spots and heat-generating components are becoming more and more serious, and more and more ultra-thin and high-performance heat-insulating materials are required.

As a result, Panasonic developed the NASBIS by creating an independent manufacturing process that fills the gaps in the fibrous membrane with nano-porous bodies with good thermal insulation properties. NASBIS has a thickness of 100 μm, is "the thinnest in the industry" (Panasonic), and has a low thermal conductivity of 0.02 W/mK, "the highest level in the industry" (Panasonic). In the future, Matsushita also plans to produce NASBIS with thicknesses of 200μm, 500μm, and 1000μm in succession.

NASBIS has little deterioration due to humidity and temperature and can maintain high insulation performance for a long period of time. In addition, even in the use environment where the narrow space inside the housing of the electronic product is squeezed, the heat insulation performance is greatly reduced (this is a problem faced by the conventional foam film), and stable heat dissipation can be achieved. Embedding this kind of NASBIS in smartphones and wearables is expected to solve the problem of heat dissipation.

In addition, through the combination of Panasonic's "PGS Graphite Film" (see this site's report), it can also provide a "heat dissipation solution" that can control the heat dissipation direction. Specifically, by blending the heat dissipation performance of the PGS graphite film and the heat insulation performance of the NASBIS, it is possible to suppress the heat of the local hot spot in a narrow space, which is favorable for reducing the temperature of the electronic product casing surface.

In the future, Panasonic will further NASBIS thin film, and improve its heat resistance and flame retardancy, to be applied to the automotive and industrial fields. (Reporter: Yutaro Kojima)

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